Embedded Systems
How Entropy can support you
Creating the optimal design for rugged defence systems can be extremely challenging. A designer must consider the end application when delivering performance rugged solutions, as the criticality of Size, Weight, Power, Cost and Cooling (SWAP-2C) will vary for each platform.
Entropy provides subject matter expertise for Defence and Industrial Embedded Systems providers in the field of mechanical design, and thermal and structural modelling for both device and system level results.
Advanced Thermal Simulation
Using extensive industry experience and simulation expertise, we are able to understand intimately the issues you face in developing performance electronic systems in high temperature environments. To ensure your new product release performance at it’s absolute maximum up to a +85°C cold wall temperature, we specialise in:
- Accurate CPU and FPGA IC package simulation models
- Junction temperature and core modelling, and hotspot identification
- Thermal Interface Material selection and modelling
- Static and transient thermal performance results
- Consideration of the effects of conduction, convection and radiation
- Performance to VITA-47.0 standards
- Delivery of performance at +85°C for conduction cards, and +71°C baseplate for rugged chassis
Shock & Vibration Simulation
Rugged PCB’s and chassis have to meet very stringent structural criteria for shock and vibration. Often the biggest challenge is making sure not only the PCB can survive these specifications but there is minimal coupling between PCB’s and a chassis system during qualification.
This can be quantified by simulation and mitigated against to optimise the performance of the product in these harsh environments. Entropy are highly familiar with the environmental challenges faced in Defence applications, and have excellent understand of MIL-STD-810, MIL-S-901, MIL-STD-167, AECTP-400 and other specifications to support design decisions and development.
As part of our service offering, Entropy can deliver:
- Random Vibration Analysis
- High and Low Cycle Fatigue Analysis
- Steinburg simplifications for PCB modelling
- MTBF prediction
- Shock & Vibration Test Plans
MTBF & Reliability Prediction
Efficient thermal management is not only critical for maximising your product performance, but is critical for ensuring the reliability of your system.
A general rule advises that failure rate doubles for every 10°C rise in temperature!
Entropy can provide updated MTBF and time to failure figures for your product BOM based on our thermal simulations. We support the following calculation models:
- MIL-HDBK-217F Notice 2
- ANSI/VITA 51.1
Mechanical Design
In addition to optimising the performance of your product, Entropy will also support the full delivery of a detailed mechanical pack. This package will provide turnkey instructions for your manufacturing partner, or can be manufactured and delivered using our existing supply chain.
Utilising our expert design engineers, who natively support Solidworks design files, will help the effectiveness of implementing new and improved solutions identified during the simulation stage. Of course we understand that often short term capacity support is needed, whether due to an unexpected problem with a customer product or simply there is no immediate resource available, and we are here to support mechanical design packages only.
Our engineers implement high quality design drawing in accordance with BS8888, for the following:
- Detailed part drawing
- Mechanical BOM creation and assembly drawings
- Tooling drawings
- CAM readable CAD files
- Surface finish and treatment instruction
- and much more
500V Electrical Isolation
Where many components have a 0V digital ground connection through the primary cooling path (ie. die or case), it can be difficult to both cool a component with the correct thermal joint and isolate the component from the system – electrical conductivity and thermal conductivity typically go hand in hand.
Although no longer a requirement in VITA-46, many product requirements still demand 500V isolation from digital ground to the chassis ground provided by the heatframe. Entropy works with trusted material providers and supply chain partners to overcome this issue and deliver solutions that allows high electrical impedance with zero cost to thermal performance.
