VITA Cooling Standards
Entropy can provide highly accurate thermal analysis and comprehensive mechanical design packages for all VITA rugged cooling methodologies.
VITA 48.1 - VPX Air Cooling
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VITA 48.2 - VPX Conduction Cooling
Conduction cooling through to chassis cold wall.
Entropy utilises a range of thermal management techniques and materials to accommodate products ranging from low power boards to CPUs delivering 100W.
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VITA 48.4 - VPX Liquid Flow Through Cooling
Liquid cooled manifold fed from external vehicle coolant loop.
Typically developed to suit the bespoke vehicular demands, Entropy can work with your program operating window to develop an ideal solution.
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VITA 48.5 - Air Flow Through Cooling
Forced air over sealed heat exchanger system.
Entropy can support with thermal analysis, detailed assembly design and part sourcing to support more complex system arrangements.
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VITA 48.7 - Air Flow By Cooling
Forced air around integrated module heatsink.
Thermal analysis support with fin optimisation for peak performance, and detailed mechanical design for package delivery.
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VITA 48.8 - Air Flow Through Cooling
Forced air through finned heat exchanger window with variable flow paths.
Entropy’s fin and heatsink optimisation studies will determine the perfect geometry to enable the highest heat transfer to the cooling air. Advanced heatsink materials and manufacturing methods may be considered to suit your program’s demands.
Alternatively, utilising forced air may not always be the optimal solution for your program. Be absolutely certain that you are making gains – not losses – when switching over from VITA 48.2 with a system level comparative study to put your mind at rest.
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VITA 74/90 - VNX+
Conduction cooling packaged in a very small, modular frame without use of card retainers.
Despite the size reduction, Entropy’s advanced solutions can cool up to 100W per slot. Additional power dissipation capability will add additional cooling demand to the chassis, which should be considered for a full solution.
Engage for a full thermal analysis and module- or chassis- level design solution.
