Case Studies

Intel Xeon E Processor

Entropy was approached by Concurrent Technologies Plc to improve the thermal performance of an existing Intel Xeon E architecture board. The mature development of the product meant that application requirements and board layout were frozen, requiring a solution that worked around the existing constraints.

Using test data from a comparative board Entropy were able to calibrate a thermal simulation with an accuracy of less than 1degC, allowing for a rapid iterative design study.

Applying best engineering principles gathered from experience managing embedded thermal electronics packages, we were able to achieve:

  • Double the thermal performance from existing test data
  • 35W TDP at +85degC cold wall with no throttling on Intel Coffee Lake device
  • 500V isolation between digital and chassis ground
  • IEEE1101.2 and V20/42 compliance

Intel Arria 10

Entropy was approached by Concurrent Technologies Plc to provide technical feasibility and a mechanical manufacturing pack for an Intel FPGA board.
Engaging at an early stage of design, before layout was finalised, allowed the technical feasibility study to derisk placement of higher power components.

Entropy was able to identify the maximum operating potential of the device to advise future roadmap opportunities, and select appropriate thermal solutions that were cost effective and production ready.

Key product points:

  • 40W TDP Intel FPGA device
  • 2LM compatilibility
  • Roadmap performance opportunity up to 100W
  • 500V isolation
  • V48.2 compliance

Xilinx Ultrascale

Hybrid DSP approached us to develop a conduction cooled solution for their Xilinx based digitizer board carrier board. This solution was required to be compatible with a COTS FMC card and suitable for a range of Ultrascale device packages.

The challenge within this project was to determine a suitable thermal solution that could accomodate a high thermal power dissipation from the FPGA, tolerate high gap sizes created by device packaging, and be cost- and assembly- effective for high production output.

Use of a high performance and high compression Thermal Interface Material (TIM) was selected from our proven vendors’ list, and verified as suitable for all configurations using hand calculation techniques.

Key product points:

  • Up to 45W Xilinx FPGA device
  • High device package variations creating high gap sizes
  • Vita 57 (FMC card) and V48.2 compliance

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