Ice Lake Xeon-D (ICL-D, ICX-D) Server Configuration is Intel’s successor to Cascade Lake, a 10 nm microarchitecture for high performance computing and servers. Ice Lake will use a second-generation enhanced 10 nm process called “10 nm+”, versus the first generation 10nm which was used for Cannon Lake. 10nm+ will feature higher performance through higher drive current for the same power envelope.
Coffee Lake Xeon-E is 64-bit hexa-core high-end performance x86 mobile workstation microprocessor introduced by Intel in early 2018. This processor, which is based on the Coffee Lake microarchitecture, is manufactured on Intel’s 3rd generation enhanced 14nm++ process. The Coffee Lake Xeon E operates at 2.7 GHz with a TDP of 45 W and a turbo boost of up to 4.4 GHz. This chip integrates Intel’s UHD Graphics 630 GPU operating at 350 MHz with a burst frequency of up to 1.2 GHz and supports up to 64 GiB of dual-channel DDR4-2666 memory with ECC support. This model has a configurable TDP-down of 35 W.
Intel® Arria® 10 FPGAs deliver more than a speed grade faster core performance and up to a 20% fMAX advantage compared to some, using publicly-available OpenCore designs. Intel® Arria® 10 FPGAs and SoCs are up to 40 percent lower power than previous generation FPGAs and SoCs and feature the industry’s only hard floating-point digital signal processing (DSP) blocks with speeds up to 1.5 tera floating-point operations per second (TFLOPS). The Intel® Arria®can have a maximum TDP of 100W.
Kaby Lake Xeon-E (KBL) is Intel’s successor to Skylake, an enhanced 14 nm process microarchitecture for mainstream desktops and mobile devices. Kaby Lake is the first “Optimization” released as part of Intel’s PAO model. The microarchitecture was developed by Intel’s R&D center in Haifa, Israel. Cannon Lake was originally set to replace Skylake as the next microarchitecture using a 10 nm process, however Intel later revised their roadmap to include Kaby Lake (with Cannon Lake being pushed back to 2018). The Kaby Lake Xeon E has a TDP of 45W.
We offer off-the-shelf full performance heatsink solutions for Intel CPUs and FPGAs. The flavours listed below are listed in order of most recent and are the primary CPUs and FPGAs available for the embedded market. These are readily available from Entropy in 3U/6U VITA 48.1-8, 0.8-1″ pitch.