Simulation + Design
Thermal Analysis
Module
Using our thorough understanding of electronics cooling behaviour, evaluate your board performance and identify areas of thermal weakness in your module design with a high accuracy thermal simulation.
New thermal solutions can be trialled within the simulation at low cost, or roadmap product performance can be identified well ahead of silicon release
Capture true board performance in all cooling environments detailed in the VITA 48.x series.
System
We will build your system in a CFD package which allows for huge data collection and environmental loading options.
With a high accuracy model, specific board loading configurations and cooling methods can be tested rapidly.
You can use these solutions to improve system power carrying capability, or reduce mass.
Vibration Analysis
Module
Evaluate the impact of vibration loading at a component level. We will recreate your module within our FEA software, and determine likely failure modes of components and solder joints under simulated loading.
With this information you may: diagnose in the field mechanical solder failures, predict early life failures of modules and view the impact of preventative design change almost immediately.
Where a detailed component analysis is not required, component performance is typically determined using Steinberg principles as instructed by VITA 51.2.
Supported standards include MIL-STD-810, MIL-S-901,MIL-STD-167, AECTP-400 and more.
Our structural simulation capability supports:
- Failure prediction analyses or MTBF
- Random Vibration Analysis
- High/Low Cycle Fatigue Analysis
- Shock & Vibration Test Plan Writing
System
Evaluate the impact of vibration or accelerated loading at a system level. We can replicate your system, including modules, cables, external fans and other hardware, to a high degree of accuracy within FEA software.
Having this model allows near infinitely diverse measurement opportunity which test could not provide. Data such as material safety factor to yield, thread stripping, joint separation and resonant frequencies can all be extracted and new designs iteratively tested with minimal additional time and cost.
Pseudo-static analysis for vibration loading implementing the widely accepted Miles’ Equations method may be implemented for representative material loading.
Supported standards include MIL-STD-810, MIL-S-901,MIL-STD-167, AECTP-400 and more.
Our structural simulation capability supports:
- Flight certification documentation
- Failure prediction analyses or MTBF
- Random Vibration Analysis
- High/Low Cycle Fatigue Analysis
- Shock & Vibration Test Plan Writing
Mechanical Design
Module
From minor updates to a comprehensive design data package, our expert engineers are ready to help.
Design packages will contain all information required to allow you to purchase and manufacture all items which will be required for the build of your module.
Mechanical design of a module includes: the development of the heat frame itself and any accessories needed, tolerance analysis for critical component mounting, Thermal Interface Material selection, retainer selection, assembly drawings, detailed manufacturing drawings and CAD files readable by all systems.
Often useful in tandem with Module Thermal Analysis to implement and achieve maximum performance.
Suitable for all cooling methodologies, including all described by the VITA 48.x series.
System
From minor updates to a comprehensive design data package, our expert engineers are ready to help.
All design packages will contain all information required to allow you to purchase and manufacture all items which will be required for the build of your system.
Mechanical design of a system includes: the development of the chassis itself, all panels required for access, and any accessories needed, assembly drawings, detailed manufacturing drawings and CAD files readable by all systems.
Often useful in tandem with System Thermal Analysis to implement and achieve maximum performance.
Digital Twin
Module
Replicate your modules as thermal Digital Clones, either to share with integrating partners or readily access for internal investigation.
Integrating partners who are looking to build and evaluate their systems will need thermal data to characterise their system as they design it.
Having Digital Clones ready to supply allows you to save your customer a significant amount of time in data gathering and processing.
We will create a highly representative models which may be tuned with real test data to give the highest possible accuracy. Module configurations can be created with multiple operating states to evaluate different programming loading depending on application.
System
Replicate your systems as thermal Digital Clones, either to share with integrating partners or readily access for internal investigation.
Integrating partners who are looking to install a multitude of systems will need to understand the thermal carrying and dispersing capability of your system.
Having Digital Clones ready to supply allows your customer evaluate your system immediately, an absolutely essential tool as the industry pushes for faster development and deployment time.
We will create a highly representative models which may be tuned with real test data to give the highest possible accuracy. Systems can easily be loaded with differing module loads and contrasted with alternative cooling methodologies to understand a truly best-for-purpose solution.
Product Performance Review
Understand the full potential in your existing products today with a Full Product Performance Review.
It’s not just new and already road-mapped projects that deserve the best solutions applied to them. Avoid carrying over poor past thermal design to products which provide the backbone of revenue stream.
For many electronics units in deployment, retroactive changes to functionality and architecture are near impossible to support.
All products within the study will be individually reviewed by our engineering team for increased thermal performance potential with no changes to board layout.
You will receive a comprehensive report on all participating products showing where improvements can be made, and for what BOM/NRE cost.
